Samsung to make base dies for Nvidia HBM using TSMC's 3nm process
According to TradingView, Samsung will produce base dies for Nvidia's NVHBM memory with TSMC 3nm technology while keeping its own HBM fabs in-house.
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what happened
According to TradingView, Samsung Electronics will make base dies for Nvidia's NVHBM memory using TSMC's 3-nanometer process. It is the first HBM-stage tie-up between Samsung and TSMC.
Nvidia was looking for TSMC-based base dies that could be paired with 6th-generation DRAM cores.
Samsung will keep in-house foundry production for standard HBM and custom memory. The company is also assessing whether its fabs could serve as a capacity backup for NVHBM if needed.
why it matters
For markets, the deal matters as a signal about how orders are being split in the AI accelerator memory segment. It shows Nvidia widening its supplier base, while giving Samsung and TSMC new production loads to fill. The source does not disclose financial terms, so the effect on either company's revenue is hard to assess for now.
market impact
Samsung, TSMC: a new Nvidia order for HBM components may affect production utilization
tags
instruments
sources
- Key facts: Samsung (005930) to use TSMC 3nm for NVHBM; retains HBM fabs — TradingView, 20 October 2026 at 00:00 UTC
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