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NVIDIA and Cisco unveil optical module for next-gen AI factories

NVIDIA and Cisco are developing a 400Gb/s-per-lane USFP module for AI-factory networks, aiming to support upgrades without replacing data-center infrastructure.

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what happened

According to Newsmetry API, citing dpa-AFX, NVIDIA Corp. (NVDA) and Cisco Systems, Inc. announced on Monday plans for Ultra-Dense Small Form Factor Pluggable, a new high-density optical module offering 400Gb/s per lane. The technology is designed for the next generation of AI factories that use pluggable transceivers.

The companies expect the solution to help customers adopt advanced optical technology and handle AI workload demands without replacing their existing data-center infrastructure. NVIDIA and Cisco are working with TE Connectivity and Amphenol on USFP cages, connectors and modules, while additional partners may join the initiative later.

The cooperation extends existing efforts to make NVIDIA Spectrum-X Ethernet and Cisco Silicon One-based Ethernet networks work together seamlessly. The goal is to simplify AI-infrastructure deployment for enterprises, neoclouds and sovereign clouds. On the Nasdaq, NVDA was trading at $226.36, down 1.38 percent, while CSCO stood at $115.09, down 2.78 percent.

why it matters

The announcement highlights a push toward pluggable optical standards for AI infrastructure and a broader collaboration among NVIDIA, Cisco, TE Connectivity and Amphenol.

instruments

NVDACSCO

sources

  1. NVIDIA, Cisco Collaborate On Ultra-Dense Small Form Factor Pluggable — Newsmetry API, 12 October 2026 at 16:46 UTC

prepared by the newsmetry newsroom with ai assistance from the sources listed below. not investment advice.

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