Infineon and Wolfspeed widen SiC wafer deal to cover 200 mm substrates

what happened

Infineon Technologies and Wolfspeed have expanded and extended their long-term silicon carbide wafer supply deal, according to a statement from Wolfspeed. The agreement now covers 200 mm wafers alongside the 150 mm volumes already supplied. The two companies have worked together for more than two decades, and Wolfspeed sees the deal as a way to strengthen its standing as a leading Western maker of SiC.

Wolfspeed chief executive Robert Feurle said that "the strong relationship between Wolfspeed and Infineon has paved the way for this expanded and extended agreement." He added that "the addition of 200 mm wafers builds on that foundation," and that the company will keep supporting Infineon's long-term silicon carbide needs.

Citing the Yole Power SiC 2026 report, Wolfspeed expects sales of SiC power devices to reach $11.1 billion by 2031, up from $3.4 billion in 2024, which implies more than three times the 2024 level over that span. Demand is being driven by industrial and energy uses such as EV charging, renewable power, energy storage and AI data centers.

why it matters

For energy and industrial power electronics, the deal suggests that demand for 200 mm SiC substrates is rising and that chipmakers are locking in supply ahead of time. The announcement does not disclose financial terms, so its effect on revenue or margins at Infineon or Wolfspeed cannot be judged from these sources.

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